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RT/duroid 5880 2-Layer 1.1mm High-Frequency PCB
PCB Material:Rogers RT/duroid 5880 / 1.1mm finished thickness
MOQ:1PCS
Price:4.99-149 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RT/duroid 5880 2-Layer 1.1mm PCB with Immersion Gold for High-Frequency Microwave Applications


1.Introduction of RT/duroid 5880

Rogers RT/duroid 5880 high-frequency laminates are PTFE composites reinforced with glass microfibers, designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5880 laminates is consistent from panel to panel and remains stable over a wide frequency range. Its low dissipation factor makes it suitable for applications extending into Ku-band and beyond. RT/duroid 5880 laminates are easily cut, sheared, and machined into shape. They are resistant to all solvents and reagents—hot or cold—commonly used in etching printed circuits or plating edges and holes.


2.Key Features

Dielectric Constant: 2.20 ±0.02 at 10 GHz/23°C
Dissipation Factor: 0.0009 at 10 GHz
Temperature Coefficient of Dk: -125 ppm/°C
Moisture Absorption: 0.02%
CTE: X: 31 ppm/°C, Y: 48 ppm/°C, Z: 237 ppm/°C
Isotropic Properties


3.Benefits

Uniform electrical properties over a wide frequency range
Easy to cut, shear, and machine
Resistant to solvents and reagents used in etching and plating
Ideal for high-moisture environments
Well-established, reliable material
Lowest electrical loss among reinforced PTFE materials


RT/duroid 5880 PCB


4.PCB Construction Details

ParameterSpecification
Base MaterialRT/duroid 5880
Layer Count2-layer
Board Dimensions110mm × 33.59mm (±0.15mm)
Min. Trace/Space4/6 mils
Min. Hole Size0.3mm
Blind ViasNo
Finished Thickness1.1mm (40 mil)
Cu Weight (Inner/Outer)1oz (35μm)
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100%

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
RT/duroid 5880 - 1.016 mm (40mil)
Copper_layer_2 - 35 μm


6.PCB Statistics:

Components: 12
Total Pads: 37
Thru Hole Pads: 29
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 56
Nets: 2


7.Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

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